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How metrology cameras with high speed combined with high image quality improve accuracy


We have talked about how high resolution, high-speed metrology cameras can improve accuracy and throughput for process control systems used in semiconductor and electronics inspection.  BUT, this is only true if the cameras provide the necessary image quality and deliver this image quality consistently  at the full frame rate. 


How Active Sensor Control Provides Reliable Pixel Data for Metrology Cameras

adimec active sensor control

The benefits of greater accuracy and throughput from high-resolution cameras can only be realized if the entire image sensor is usableMetrology cameras are optimized for uniformity and dynamic range among other parameters to provide the most accurate starting image.  Metrology cameras are relied on when the pixel information is used as measurement input such as with process control systems for semiconductor and electronics manufacturing and others.   

Are frame grabbers ready for QUAD CoaXPress (4 x CXP-6) with a speed of 25 Gbits/sec?

CoaXPress frame grabber list 2014

The great answer is yes!  There have been many more CoaXPress frame grabbers made available this year. 

Sneak Peak of Adimec's new high resolution camera for industrial metrology


Adimec provides a sneak peak at our new OEM camera for industrial metrology that will be unveiled at the Vision Show 2014.  A few hints…high resolution, high speed, CoaXPress, low power.

Adimec’s Industrial Imaging and Machine Vision Blog: Best of 2014 so far


Hopefully our blog has been a source of helpful information over the last few years.  Here are quick links to some of our most popular blogs this year in case you missed them.  Subscribe to our blog or join the Adimec LinkedIn group to stay updated with the latest information.  

3D Metrology OEM Camera Requirements

CTA 3D Metrology Camera Requirements copy

As the objects to inspect/measure in high-tech manufacturing become smaller, higher-resolution cameras with better spatial resolution can improve accuracy and precision.  This requires a high-quality machine vision camera design, or what is now called a metrology camera.  3D measurements in particular pose increasing demands on camera performance and reliability.  


High-resolution CoaXPress cameras with image processing for expanded networking capabilities


The BASTION project was initiated on April 1, 2014 with the main of objective to research and develop new applications for the Broadcast Market, and for the Security and Surveillance Markets.  Both will be built on top of the Internet Protocol network, which will allow distributing the video over several physical sites. The cameras will be located on one or more sites, and the monitoring/control room will be on a separate site. The main benefit of this distribution is that it will enable:

Industrial metrology cameras for increased throughput and accuracy


We recently published several articles about how OEM metrology cameras can help you make a performance leap with your process control system. Here are some details about how high resolution cameras are increasing throughput and accuracy for semiconductor and electronics metrology and inspection systems. 


Industrial Metrology cameras for increased performance of process control systems

Adimec camera repeatability

In our post about detecting smaller features with metrology cameras, we made the designation between mainstream machine vision cameras and industrial metrology cameras. [See slide 7 in Yole Developpement's Machine Vision Market report presentation].  Here are some more details on when a metrology camera will provide a performance advantage.

Increase Accuracy of Optical 3D Measurements

3d camera requirements machine vision

In semiconductor and electronics manufacturing, there has been a move towards 3D measurements to provide accurate process control of smaller dimensions for higher yield and quality of new packaging technologies.  For example in electronics manufacturing a 2D view from the top only allows for detection of defects such as shifts, rotations, and cracks, but not whether components are flat on the board or the volume of solder paste.

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