Focus on SWaP-C at the 2013 SPIE Defense, Security, and Sensing

Posted by Gretchen Alper on Wed, May 8, 2013

The SPIE Defense, Security, and Sensing Exhibition is an opportunity for camera, sensor, optics, computer and other systems builders to share their latest innovations with the global security market. 

For many years there has been talk about reduction in size, weight, and power (SWaP) for both wearable, airborne, and vehicle systems.  With decreases in government spending, this has been changed to SWaP-C to include cost reductions as well. 

The challenge with SWaP-C restrictions is to also add more advanced capabilities.  Many computing and electronics components were presented at the exhibition to meet all of these needs. 

For example, Adimec expanded its latest TMX-DHD series of full HD electro-optical sensor modules.  In addition to the remote sensor head design (TMX6-DHD), a cube outline (TMX7-DHD) and a board-level (TMX7-DHD BLC) options are now available for integration in airborne payloads and other sensor system architectures.  These are all (rugged) designed with minimized size, weight, and power, and costs while offering full HD resolution, extended sensitivity, and crisp color images regardless of the environmental conditions.

The cameras are optimized for use in UAVs, security and situational awareness systems that require optimal detection, recognition and identification capabilities.

Click below to see a demonstration of the TMX6-DHD rugged, color, HD camera:



Related Blogs:

Reduce Costs with Custom Machine Vision, Medical, or Rugged Cameras

Cube and Board Level Options with Rugged HD Daylight Cameras

How to Avoid Life Cycle Costs with COTS 

Considerations with Board Level Camera Modules 

Designing Cameras into Rugged Electro-Optical Systems

Topics: New Adimec Products

Previous blog:

Next blog: